glass cutting header hero image

Glass Polishing

From a long history of producing Photomasks and CD Master Glass, Coresix has evolved our lapping and polishing processes to meet the current day quality and cleanliness demands of  the Semiconductor, Biotech, Photolithography, Display and other advancing technological markets. Though we specialize in SEMI Standard Wafers (50.8mm 0 450mm) using most any type of glass, our processes can be adapted to unique formats and requirements.  Our polishing department has the expertise to meet the highest quality demands and the capacity to provide consistency at the highest production levels.


scribe and break photo

Single Slide Polishing

Once reduced to near-final thickness through single-side lapping, a similar proprietary process is used to polish the surface clear and produce surface qualities to as low as 10/5 scratch and dig with sub-nanometer surface roughness.

water jet photo

Double Side Polishing

After lapping to thickness, the opaque surface is first cleared through our First (or Commercial) Polishing Process. With typical scratch and dig results of 60/40 and roughness of <1nm, this can be the final stage for less critical surface requirements.

wire saw photo

Double Side Final Polishing

Our double-side final glass polishing process maintains the flatness and parallelism characteristics achieved through the lapping process while creating a pristine surface with low roughness and surface defects. We can generally achieve scratch and dig specs as low as 5/2 and roughness to 5 Angstroms.

edging photo

Double Side Super Polishing

Where extremely smooth surfaces are required, our Super Polish process can achieve roughness as low as 2 Angstroms while effectively eliminating any sub-surface damage from previous lapping and polishing processes.

Common Edging Terms

Is a measurement of the small-scale variations in the height of a physical surface. A common measure of surface roughness is the RMS (root-mean-square) height h of the surface bumps.

This refers to the irregularities which are outside the roughness width cut-off values. Waviness height is the peak to valley distance of the surface profile, measured in microns.

Super Polish
This is an advanced polishing process designed to eliminate polishing micro-structure on the surface of the glass and produce roughness to <3วบ.

Polishing Capabilities

Polish Minimum Maximun Tolerance
Flatness 1/10 Wave n/a n/a
Bow/Warp <1um/Inch n/a n/a
TTV NA +/-1um    
Thickness 200um n/a +/-5um
Size 10mm 300mm +/-0.10mm